91香蕉成人免费网站/91精品国产免费久久/99久久就热视频精品/国产成人久久激情91

High frequency mixed-pressure board

Surface treatment：ENIG
Number of layers：4
Board Thickness：0.9mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.12/0.12mm
Particularity：Rogers 4835 + FR4
Application：automotive radar

High frequency mixed-pressure board

Surface treatment：ENIG Number of layers：6
Board Thickness：1.15mm
Min. Hole Size：0.25mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：mechanically drilled blind hole, Rogers 4350 + FR4
Application：ADAS

Thick copper plate

Surface treatment：ENIG
Number of layers：12
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：Particularity: resin plug hole, depth control drill
Application：power supply

PCB with embedded copper coin

Surface treatment：ENIG
Number of layers：Number of layers: 3
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：copper-inlay
Application：communication

Double-sided through hole filling board

Surface treatment：ENIG
Number of layers：2L
Board Thickness：0.5mm
Min. Hole Size： 0.3mm
Min. trace width/trace space: 0. 2/0. 2mm
Particularity：through-hole filling; aspect ratio 1: 1
Application：LED

Long and short golden finger board

Surface treatment：ENIG
Number of layers：6L
Board Thickness：0.8mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0. 15/0.15mm
Particularity：long and short gold finger + step routing slot
Application：industrial control

HDI boards

Surface treatment：ENIG
Number of layers：4
Board Thickness：1.2mm
Min. Hole Size：0.075mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：2-order HDI, blind hole, buried hole
Application：communication

HDI Rigid-Flex board

Surface treatment：ENIG
Number of layers：8L
Board Thickness：1.3mm
Min. Hole Size： 0.1mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：1st order HDI, blind hole, buried hole, rigid-flex
Application：automotive electronics

Semi-rigid-flex board

Surface treatment：ENIG
Number of layers： 4L
Board Thickness：2.1mm
Min. Hole Size：0.3mm
Min. trace width/trace space: 0.2/0.2mm
Particularity：semi-flex
Application：communication

Double-sided flexible board

Surface treatment：electrogilding
Layer count：2L
Maximum finished board thickness：0.15±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：industrial control

Double-sided flexible medical board

Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.15±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：medical

Double-sided flexible impedance board

Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.10±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：impedance accuracy: 10%
Application：UAV

Multi-layer flexible board

Surface treatment：Surface treatment: immersion gold
Layer count：4
Maximum finished board thickness：0.2mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.1mm
Feature：Impedance accuracy ±10%
Application：Application: smartphone (camera)

Double-sided flexible fingerprint

Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12 ± 0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：
Application：smartphone (fingerprint identification)

Double-sided flexible fingerprint

Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：
Application：smartphone (fingerprint identification)

Double-sided flexible fingerprint

Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：laser spot welding
Application：smartphone (fingerprint identification)

Dual-sided flexible phone USB board

Surface treatment：ENIG
Layer count：2
Maximum finished board thickness：0.11±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.085/0.09mm
Feature：
Application：smartphone

Double-sided flexible display module board

Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.055/0.06mm
Feature：
Application：liquid crystal display module

Double-sided flexible display module board

Surface treatment：ENIG
Layer count：2L
Maximum finished board thickness：0.12±0.03mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.04/0.08mm
Feature：
Application：liquid crystal display module

PCBA

Rigid-flex PCB

更多產(chǎn)品

Rigid-flex board

Surface treatment：ENIG
Number of layers： 6L
Board Thickness： 0.79mm
Min. Hole Size： 0.3mm
Min. trace width/trace space: 0.15/0.15mm
Particularity： long and short gold finger + step routing slot
Application：industrial control

Rigid-flex board

Surface treatment：ENIG
Number of layers：4L
Board Thickness：0.6mm
Min. Hole Size：0.12/0.12mm
Min. trace width/trace space: 0. 3mm
Particularity：
Application： industrial control

Rigid-flex board

Surface treatment： ENIG
Number of layers：12L
Board Thickness：1.02mm
Min. Hole Size：0.2mm
Min. trace width/trace space: 0.1/0.1mm
Particularity：Fine lines, micro-vias
Application：industrial control

Double-sided flex board

Surface treatment： immersion gold
Layer count： 2
Maximum finished board thickness：0.13±0.03mm
Minimum hole size：0.20mm
Minimum trace width /spacing: 0.07/0.07mm
Feature：
Application：smartphone

Multi-layer flexible impedance board

Surface treatment：immersion gold
Layer count：3
Maximum finished board thickness：0.2±0.05mm
Minimum hole size：0.20mm
Minimum trace width /spacing: 0.15/0.078mm
Feature：
Application：smartphone

Multi-layer flexible impedance board

Surface treatment： immersion gold
Layer count：4
Maximum finished board thickness：0.25±/-0.03mm
Minimum hole size：0.10mm
Minimum trace width /spacing: 0.06/0.06mm
Feature：impedance accuracy: ±10%
Application：smartphone

Multi-layer flexible impedance board

Surface treatment： immersion gold
Layer count：3
Maximum finished board thickness：0.23±0.05mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.10/0.15mm
Feature：impedance accuracy ±10%
Application：smartphone

Soft-hard board

Surface treatment：ENIG
Layer count：6L
Maximum finished board thickness：0.5±0.02mm/-0.05 mm
Minimum hole size：0.15mm
Minimum trace width /spacing: 0.07/0.06mm
Feature：
Application：smartphone

PCBA

制程能力

Layer Count:	1-32 Layers
Min Line width/Line space:	3 mil/3 mil
Min mechanical drilling hole size	Board thickness≦ 1.2mm 0.15mm
	Board thickness≦ 2.5mm 0.2mm
	Board thickness>2.5mm Aspectratio≦ 15:1
Aspect ratio	15:1
Finished Board Thickness	Max 10mm
Finished Board Thickness	Min 2L: 0.2mm; 4L: 0.35mm; 6L: 0.55mm; 8L: 0.8mm; 10L: 1.0mm
Finished copper thickness(inner layer/out layer)	6oz/10oz
Max panel size	450x1800mm (18"x71")
PTH wall thickness	0.025mm
PTH hole dia. tolerance	±0.075mm
Non PTH hole dia. tolerance	±0.05mm
Hole position deviation	±0.05mm
Outline tolerance	±0.10mm
Min S/M Pitch	0.075mm
Twist and Bow	≤1.0%
Test Voltage	50~300v
Electric strength	＞1.3KV/mm
Current breakdown	10A
Peel strength	1.4N/mm
Soldermask abrasion	＞6H
Thermal stress	288℃ 20Sec
Flammability	94V-0
Impedance Control	+/-5%(Differential)
Blind/Buried via	yes
Surface Finished	ENIG, ImAg ,ImSn, OSP, Leaded HAL, Lead free HAL(SN100C), Flash Gold,Hard Gold
Impedance Tolerance	± 10%
Min dielectric thickness	2mil
Type of dielectric material	FR4, High TG, Halogen Free material, Aluminum basedmatcrial,Copper based material,High frequency material, PTFE material, Heavy copper foil,Paperphenolic plate, BT, PI, Composite material, PTFE+metal based.
Major Material supplier	Shengyi 、 ITEQ、 Isola、Ventec、 KB、Rogers、Taconic、Nelco、Bergquist。

特色技術(shù) ‐ 盲孔和埋孔，焊盤，硬金和金手指，閃金，鎳/鈀/金表面處理，邊緣電鍍，卡式孔，壓入孔，深度控制布線，埋頭孔。

品質(zhì)體系和標(biāo)準(zhǔn)

◆ 完全符合ISO 質(zhì)量管理體系，通過了ISO9001:2008, ISO14001:2004, ISO/TS16949:2009美國和加拿大UL認(rèn)證

◆ AOI、孔銅測(cè)試、可焊性測(cè)試、XRF測(cè)試、阻抗控制/測(cè)試、金相測(cè)試分析

◆ 100% 測(cè)試和檢驗(yàn)，產(chǎn)品符合IPC-A-600-H和IPC-6012標(biāo)準(zhǔn)

◆ 出貨前二次檢驗(yàn)

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Layer Count:	SolderMask Color:	Silkscreen Color:	different types of the boards in one panel
Material:	Finish Size (mm)	Panel Quantity:	Test Points/pcs:
Finished Thickness:	Gold Finger	X-OUTS per Array:	other special treatments
Basic copper Thickness：	Min.line width	Impedence Control:
Finished copper Thickness:	Min. trace	Blind Buried Hole:
Surface treatment:	Min.Drill:	Inspection Standard:
Gold Area:	Hole Copper(um)	Country to deliver:
*Name:	*Email:	*Mobile:	*Company:

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